Micromechanical modelling of functionally graded materials

Computational Materials Science

Volumn 13, Issue 1-3, 1998, Pages 42-55

  Gasik, Michael M ^a  

^a AALTO UNIVERSITY   (Finland)

Author keywords

Copper; Graded materials; Micromechanical model; Stress analysis; Tungsten

Indexed keywords

EID: 0002077467     PISSN: 09270256     EISSN: None     Source Type: Journal    
DOI: 10.1016/s0927-0256(98)00044-5     Document Type: Article

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