Out-of-plane stresses arising from grain interactions in textured thin films

Acta Materialia

Volumn 58, Issue 7, 2010, Pages 2452-2463

  Vodnick, Aaron M ^a   Nowak, David E ^a   Labat, Stephane ^b   Thomas, Olivier ^b   Baker, Shefford P ^a  

^a Cornell University   (United States)

^b AIX MARSEILLE UNIVERSITÉ   (France)

Author keywords

Mechanical properties; Synchrotron radiation; Thin films; X ray diffraction

Indexed keywords

CU FILMS; FACE-CENTERED CUBIC; FIBER TEXTURE; GRAIN INTERACTION; IN-PLANE STIFFNESS; IN-PLANE STRESS; INHOMOGENEITIES; MECHANICAL BEHAVIOR; NORMAL DIRECTION; OUT-OF-PLANE; POISSON EFFECTS; TEXTURE DEVELOPMENT; TRI-AXIAL STRESS STATE; X RAY DATA; X-RAY STUDIES;

COPPER; DIFFRACTION; MECHANICAL PROPERTIES; SYNCHROTRON RADIATION; SYNCHROTRONS; TEXTURES; THIN FILMS; X RAY DIFFRACTION;

STRESSES;

EID: 77449117607     PISSN: 13596454     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.actamat.2009.12.031     Document Type: Article

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