Formation and growth of intermetallic compounds at the interface between Pb-free solder and Cu-Zn alloy UBM

Proceedings - 2007 International Symposium on Microelectronics, IMAPS 2007

Volumn , Issue , 2007, Pages 48-51

  Oh, Chang Yul ^a   Roh, Hee Ra ^a   Kim, Young Ho ^a  

^a Hanyang University   (South Korea)

Author keywords

Cu Zn alloy UBM; Intermetallic compounds; Lead free solders; Zn addition

Indexed keywords

CU-ZN ALLOY; GROWTH OF INTERMETALLICS; KIRKENDALL VOID; LEAD FREE SOLDERS; PB FREE SOLDERS; SAC-SOLDERS; SOLDER ALLOYS; SOLDER JOINTS;

INTERMETALLICS; LEAD; LEAD COMPOUNDS; MICROELECTRONICS; SILVER; SOLDERING; SOLDERING ALLOYS; THERMAL AGING; TIN; ZINC; ZINC ALLOYS;

COPPER COMPOUNDS;

EID: 84876909903     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (13)

1. D. Suraski, D. Seelig, "The Current Status of Lead-Free Solder Alloys", IEEE Transactions on Electronics Packaging Manufacturing, Vol. 24, No. 4, October, pp. 244-248, 2001.
2. C.M. Miller, I.E. Anderson, and J.F. Smith, "A Viable Tin-Lead Solder Substitute: Sn-Ag-Cu", Journal of Electronic Materials, Vol. 23, No. 7, pp. 595-601, 1994.
3. K. Zeng, K.T. Tu, "Six cases of reliability study of Pb-free solder joints in electronic packaging technology", Materials Science and Engineering, pp.55-105, 2002.
4. T.Y. Lee, W.J. Choi, and K.N. Tu, "Morphology, kinetics, and thermodynamics of solid-state aging of eutectic SnPb and Pb-free solders (Sn-3.5Ag, Sn-3.8Ag-0.7Cu and Sn-0.7Cu) on Cu", J. Mater. Res., Vol. 17, No. 2, pp. 291-301, February, 2002.
5. P. T. Vianco, J. A. Rejent and P. F. Hlava, "SolidState Intermetallic Compound Layer Growth Between Copper and 95.5Sn-3.9Ag-0.6Cu Solder", Journal of Electronic Materials, Vol. 33, No. 9, pp. 991-1003, 2004.
6. I. de Sousa, D. W. Henderson, L. Patry, and S.K. Kang, "The Influence of Low Level Doping on the Thermal Evolution of SAC Alloy Solder Joints with Cu Pad Structures", Electronic Components and Technology Conference, pp. 1454-1461, 2006.
7. S.K. Kang, D. Leonard, D.Y. Shih, and L. Gignac, "Interficial Reactions of Sn-Ag-Cu Solders Modified by minor Zn alloying addition", IBM Research Report, March 9, 2005.
8. F.J. Wang, F. Gao, X. Ma, and Y.Y. Qlan, "Depressing Effect of 0.2wt.%Zn Addition into Sn-3.0Ag-0.5Cu Solder Alloy on the Intermetallic Growth with Cu Substrate during Isothermal Aging", Journal of Electronic Materials, Vol. 35, No. 10, pp. 1818-1824, 2006.
9. F.J. Wang, Z.S. Yu, and K. Qi, "Intermetallic compound formation at Sn-3.0Ag-0.5Cu-1.0Zn lead-free solder alloy/Cu interface during as-soldered and as-aged conditions", Journal of Alloys Compounds, Vol. 438, pp.110-115, July, 2007.
10. H. Wang, F. Wang, F. Gao, X. Ma, and Y. Qian, "Reactive wetting of Sn0.7Cu-xZn lead-free solders on Cu substrate" Journal of Alloys and Compounds, Vol. 433, pp. 302-305, 2006.
11. K.N. Tu, T.Y. Lee, J.W. Jang, L. Li, D.R. Frear, K. Zeng, and J.K. Kivilahti, "Wetting reaction versus solid state aging of eutectic SnPb on Cu", Journal of Applied Physics, Vol. 89, No. 9, pp. 4843-4849, May, 2001.
12. S.K. Kang, D.Y. Shih, D. Leonard, Donald W. Henderson, T. Gosselin, S.I. Cho, J. Yu, and W.K. Choi, "Controlling Ag3Sn Plate Formation in Near-Ternary-Eutectic Sn-Ag-Cu Solder by Minor Zn Alloying" JOM, Vol. 56, Num. 6, pp. 34-38, June, 2004.
13. S.K. Kang, W.K. Choi, D-Y. Shih, D.W. Henderson, T. Gosselin, A. Sarkhel, C. Goldsmith and K.J. Puttlitz, "Formation of Ag3Sn Plates in Sn-Ag-Cu Alloys and Optimization of their Alloy Composition" Electronic Components and Technology Conference, pp. 64-70, May, 2003.