Mechanical properties of a lead-free solder alloys

Proceeding of 2005 International Conference on Asian Green Electronics- Design for Manufacturability and Reliability, 2005AGEC

Volumn 2005, Issue , 2005, Pages 107-112

  Zhu, Fulong ^a   Wang, Zhiyong ^a   Guan, Rongfeng ^a   Zhang, Honghai ^a  

^a HUAZHONG UNIVERSITY OF SCIENCE AND TECHNOLOGY   (China)

Author keywords

Lead free; Microstructure; Sn Ag Cu; Solder; Tensile property

Indexed keywords

ELECTRONICS PACKAGING; ENVIRONMENTAL IMPACT; LEAD; MICROELECTRONICS; POLLUTION; TENSILE PROPERTIES; TENSILE STRENGTH;

LEAD-FREE; SN-AG-CU; SOLDERS;

SOLDERING ALLOYS;

EID: 33745009027     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/AGEC.2005.1452326     Document Type: Conference Paper

References (9)

1. F. Guo, S. Choi, K.M. Subramanian, T.R. Bieler, J.P. Lucas, A. Achari, M. Paruchuri, Evaluation of creep behavior of near-eutectic Sn-Ag solders containing small amount of alloy additions. Materials Science and Engineering A351 (2003) 190-199.
2. Ikuo Shohji, Tomohiro Yoshida, Takehiko Takahashi, Susumu Hioki. Tensile properties of Sn-Ag based lead-free so.ders and strain rate sensitivity. Materials Science and Engineering A366 (2004) 50-55.
3. S. Kikuchi, M. Nishimura, K. Suetsugu, T. Ikari, K. Matsushige. Strength of bonding interface in lead-free Sn alloy solders. Materials Science and Engineering A319-321 (2001) 475-479.
4. Jie Zhao, Yoshiharu Mutoh, Yukio Miyashita, Lai Wang. Fatigue crack growth behavior of Sn-Pb and Sn-based lead-free solders. Engineering Fracture Mechanics 70 (2003) 2187-2197.
5. K.S. Kim, S.H, Huh, K. Suganuma. Effects of cooling speed on microstructure and tensile properties of Sn-Ag-Cu alloys. Materials Science and Engineering A333 (2002) 106-114.
6. C. Kanchanomai, Y. Miyashita, Y. Mutoh, S.L. Mannan. Influence of frequency on low cycle fatigue behavior of Pb-free solder 96.5Sn-3.5Ag. Materials Science and Engineering A345 (2003) 90-98
7. Masazumi Amagai, Masako Watanabe, Masaki Omiya, Kikuo Kishimoto, Toshikazu Shibuya.Mechanical characterization of Sn-Ag-based lead-free solders. Microelectronics Reliability 42 (2002) 951-966.
8. J.M. Song, G.F. Lan, T.S. Lui, L.H. Chen. Microstructure and tensile properties of Sn-9Zn-xAg lead-free solder alloys. Scripta Materialia 48 (2003) 1047-1051.
9. C. Kanchanomai, Y. Mutoh. Effect of temperature on isothermal low cycle fatigue properties of Sn-Ag eutectic solder. Materials Science and Engineering A 381 (2004) 113-120