Soldering pad surfaces-gold, silver & their IMCs: Solder joint embrittlement

Global SMT and Packaging

Volumn 3, Issue 6, 2003, Pages 29-32

  Engelmaier, Werner ^a,b  

^a Engelmaier Associates LC

^b IPC Main Comm on Prod Reliability ^*

Author keywords

[No Author keywords available]

Indexed keywords

CERAMIC PRODUCTS; CORROSION; CRYSTAL STRUCTURE; CRYSTALLINE MATERIALS; EMBRITTLEMENT; GOLD; INTERMETALLICS; OXIDATION; PROBLEM SOLVING; SILVER; SOLDERED JOINTS; SUBSTRATES;

CRYSTALLINE-PLATELETS; HYBRID ELECTRONICS; METALLURGICAL BONDS; SOLDERING PAD SURFACES;

SOLDERING;

EID: 2942752046     PISSN: 14740893     EISSN: None     Source Type: Journal    
DOI: None     Document Type: Review

References (0)