Solder joint formation & intermetallic compounds (IMCs)

Global SMT and Packaging

Volumn 3, Issue 4, 2003, Pages 36-38

  Engelmaier, Werner ^a,b  

^a Engelmaier Associates LC

^b IPC Main Comm on Prod Reliability ^*

Author keywords

[No Author keywords available]

Indexed keywords

BRITTLENESS; CHEMICAL BONDS; CRYSTALLINE MATERIALS; FRACTURE; INFRARED RADIATION; INTERMETALLICS; METALLIZING; PRINTED CIRCUIT BOARDS; SURFACE PROPERTIES; WETTING;

DE-WETTING; METALLURGICAL BONDS; SURFACE METALS; THERMAL ENERGY;

SOLDERED JOINTS;

EID: 2942717180     PISSN: 14740893     EISSN: None     Source Type: Journal    
DOI: None     Document Type: Review

References (0)