HotSpot: A dynamic compact thermal model at the processor-architecture level

Microelectronics Journal

Volumn 34, Issue 12 SPEC.ISS., 2003, Pages 1153-1165

  Stan, Mircea R ^a   Skadron, Kevin ^a   Barcella, Marco ^a   Huang, Wei ^a   Sankaranarayanan, Karthik ^a   Velusamy, Sivakumar ^a  

^a University of Virginia   (United States)

Author keywords

Computer architecture; Dynamic compact models; Thermal models

Indexed keywords

CAPACITANCE; COMPUTATIONAL METHODS; COMPUTER SIMULATION; HEAT LOSSES; HEAT RESISTANCE; NETWORKS (CIRCUITS); PROGRAM PROCESSORS; THERMAL EFFECTS;

THERMAL MANAGEMENT;

COMPUTER ARCHITECTURE;

EID: 0242406726     PISSN: 00262692     EISSN: None     Source Type: Journal    
DOI: 10.1016/S0026-2692(03)00206-4     Document Type: Conference Paper

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