A study of stacking limit and scaling in 3D ICs: An interconnect perspective

Proceedings - Electronic Components and Technology Conference

Volumn , Issue , 2009, Pages 1213-1220

  Healy, Michael B ^a   Lim, Sung Kyu ^a  

^a GEORGIA INSTITUTE OF TECHNOLOGY   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

3-D ICS; DYNAMIC NOISE; IR-DROP; LARGE SYSTEM; LIMITING FACTORS; NOISE CHARACTERISTIC; POWER DISSIPATION; POWER SUPPLY; THERMAL RELIABILITY; THERMAL SIMULATIONS; THROUGH-SILICON-VIA; TOPOLOGY CHARACTERISTICS;

CUSTOMER SATISFACTION; THREE DIMENSIONAL;

COOLING SYSTEMS;

EID: 70349680418     PISSN: 05695503     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/ECTC.2009.5074166     Document Type: Conference Paper

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