Fluid-to-Fluid spot-to-spreader (f2/s2) hybrid heat sink for integrated chip-level and hot spot-level thermal management

Journal of Electronic Packaging

Volumn 131, Issue 2, 2009, Pages 0250021-02500210

  Green, Craig ^a   Fedorov, Andrei G ^a   Joshi, Yogendra K ^a  

^a GEORGIA INSTITUTE OF TECHNOLOGY   (United States)

Author keywords

Hot spots; Liquid cooling

Indexed keywords

COMPUTATIONAL FLUID DYNAMICS; COOLING; COOLING SYSTEMS; HEAT SINKS; HEATING EQUIPMENT; SPREADERS; THERMAL MANAGEMENT (ELECTRONICS);

CHIP-LEVEL; COMPUTATIONAL FLUID DYNAMICS SIMULATIONS; COOLING REQUIREMENTS; HEAT SINK DESIGN; HOTSPOTS; HYBRID HEAT SINK; INTEGRATED CHIPS; LIQUID COOLING; ON CHIPS; OPTIMIZATION CALCULATION;

HEAT FLUX;

EID: 77955189251     PISSN: 10437398     EISSN: 15289044     Source Type: Journal    
DOI: 10.1115/1.3104029     Document Type: Article

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