Design and performance evaluation of a compact thermosyphon

IEEE Transactions on Components and Packaging Technologies

Volumn 25, Issue 4, 2002, Pages 601-607

  Pal, Aniruddha ^a   Joshi, Yogendra K ^a   Beitelmal, Monem H ^b   Patel, Chandrakant D ^b   Wenger, Todd M ^c  

^a GEORGIA INSTITUTE OF TECHNOLOGY   (United States)

^b HEWLETT PACKARD LABORATORIES   (United States)

^c Subsidiary of Modine Mfg Company   (United States)

Author keywords

Dielectric liquid cooling; Electronics cooling; Thermosyphon design

Indexed keywords

COMPUTER SIMULATION; DIELECTRIC LIQUIDS; EVAPORATORS; HEAT LOSSES; MICROPROCESSOR CHIPS; NUMERICAL ANALYSIS; PERSONAL COMPUTERS;

ELECTRONICS COOLING;

COOLING SYSTEMS;

EID: 0036999790     PISSN: 15213331     EISSN: None     Source Type: Journal    
DOI: 10.1109/TCAPT.2002.807997     Document Type: Conference Paper

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