Stacked microChannel heat sinks for liquid cooling of microelectronic components

Journal of Electronic Packaging

Volumn 126, Issue 1, 2004, Pages 60-66

  Wei, Xiaojin ^a   Joshi, Yogendra ^a  

^a GEORGIA INSTITUTE OF TECHNOLOGY   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

ASPECT RATIO; COMPUTATIONAL METHODS; COMPUTER SIMULATION; COOLING; FRICTION; HEAT RESISTANCE; MICROELECTRONICS;

BASE AREA; CROSS-SECTIONS; FLOW RATE; THERMAL MANAGEMENT;

HEAT SINKS;

EID: 8744298193     PISSN: 10437398     EISSN: None     Source Type: Journal    
DOI: 10.1115/1.1647124     Document Type: Article

References (9)

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8. Shah, R. K., and London, A. L., 1978, "Laminar Row Forced Convection in Ducts," Supplement 1 in Advances in Heat Transfer, Irvine, T. F., and Hartnett, J. P., eds., Academic, New York.
9. Yin, X., and Bau, H. H., 1997, "Uniform Channel Micro Heat Exchangers," J. Electronic Packaging, 119. pp. 89-94.