Temperature-aware computer systems: Opportunities and challenges

IEEE Micro

Volumn 23, Issue 6, 2003, Pages 52-61

  Skadron, Kevin ^a   Stan, Mircea R ^a   Huang, Wei ^a   Velusamy, Sivakumar ^a   Sankaranarayanan, Karthik ^a   Tarjan, David ^b,c  

^a University of Virginia   (United States)

^b ETH ZURICH   (Switzerland)

^c UNIVERSITY OF VIRGINIA   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

HEAT DENSITY; THERMAL ENGINEERING;

COOLING; COST EFFECTIVENESS; ELECTRONICS PACKAGING; HEATING; INTEGRATED CIRCUIT LAYOUT; MICROPROCESSOR CHIPS; TEMPERATURE CONTROL;

COMPUTER ARCHITECTURE;

EID: 1342346134     PISSN: 02721732     EISSN: None     Source Type: Journal    
DOI: 10.1109/MM.2003.1261387     Document Type: Review

References (14)

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