Thermal analysis of three-dimensional (3-D) integrated circuits (ICs)

Proceedings of the IEEE 2001 International Interconnect Technology Conference, IITC 2001

Volumn , Issue , 2001, Pages 157-159

  Rahman, A ^a   Reif, R ^a  

^a Massachusetts Institute of Technology Cambridge   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

EID: 85001141006     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/IITC.2001.930045     Document Type: Conference Paper

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