Copper pattern on self-assembled monolayer through microcontact printing

Journal of Nanoscience and Nanotechnology

Volumn 10, Issue 5, 2010, Pages 3072-3077

  Liu, Zheng Chun ^a   Yang, Fei Peng ^a   Xu, Xiao Wen ^a   Guo, Can ^a   Liu, Jian Xin ^a  

^a CENTRAL SOUTH UNIVERSITY   (China)

Author keywords

Copper pattern; Electroless plating; Microcontact printing; Self Assembled monolayer

Indexed keywords

3-MERCAPTOPROPYLTRIMETHOXYSILANE; AG PARTICLES; COPPER PATTERN; DISULFIDE LINKAGES; ELECTRICAL RESISTIVITY; ELECTROLESS CU PLATING; ETHANOL SOLUTIONS; FOUR-POINT PROBE TECHNIQUES; GLASS SUBSTRATES; HEXADECANETHIOL; HYDROPHOBIC TREATMENT; MICRO CONTACT PRINTING; POTENTIAL TECHNIQUES; SAMS; SEM; WATER CONTACT ANGLE MEASUREMENT; XPS SPECTRA;

ANGLE MEASUREMENT; CONTACT ANGLE; COPPER; ELECTRIC CONDUCTIVITY; ELECTROLESS PLATING; ELECTRON DEVICE MANUFACTURE; ELECTRON ENERGY LEVELS; ETHANOL; GLASS; ORGANIC POLYMERS; PRINTING; SILVER; SUBSTRATES; X RAY PHOTOELECTRON SPECTROSCOPY;

SELF ASSEMBLED MONOLAYERS;

EID: 77954997281     PISSN: 15334880     EISSN: None     Source Type: Journal    
DOI: 10.1166/jnn.2010.2179     Document Type: Conference Paper

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