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Volumn 257-258, Issue , 2005, Pages 283-286

Electroless plating of copper through successive pretreatment with silane and colloidal silver

Author keywords

Colloidal Ag; Electroless copper plating; Self assembled molecular layer

Indexed keywords

ACTIVATION ANALYSIS; COLLOIDS; COPPER; DEPOSITION; GLASS; METALLIC FILMS; PALLADIUM COMPOUNDS; SELF ASSEMBLY; SILANES; SILVER;

EID: 15044357451     PISSN: 09277757     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.colsurfa.2004.10.036     Document Type: Conference Paper
Times cited : (41)

References (19)
  • 1
    • 0003423037 scopus 로고
    • Finishing Publications Metals Park
    • W. Riedel Electroless Nickel Plating 1991 Finishing Publications Metals Park Chapters 1, 3 and 9
    • (1991) Electroless Nickel Plating
    • Riedel, W.1
  • 4
    • 0001827431 scopus 로고
    • Metallizing of plastics
    • R. Suchentrunk ASM International Materials Park
    • H. Ebneth Metallizing of plastics R. Suchentrunk Handbook of Theory and Practice vol. 30 1993 ASM International Materials Park 30
    • (1993) Handbook of Theory and Practice , vol.30 , pp. 30
    • Ebneth, H.1
  • 6


* 이 정보는 Elsevier사의 SCOPUS DB에서 KISTI가 분석하여 추출한 것입니다.