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Volumn 257-258, Issue , 2005, Pages 283-286
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Electroless plating of copper through successive pretreatment with silane and colloidal silver
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Author keywords
Colloidal Ag; Electroless copper plating; Self assembled molecular layer
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Indexed keywords
ACTIVATION ANALYSIS;
COLLOIDS;
COPPER;
DEPOSITION;
GLASS;
METALLIC FILMS;
PALLADIUM COMPOUNDS;
SELF ASSEMBLY;
SILANES;
SILVER;
COLLOIDAL SILVER;
COPPER FILMS;
MERCAPTOPROPYLTRIMETHOXYSILANE (MPTS);
PRETREATMENT;
ELECTROLESS PLATING;
COPPER;
GLASS;
LEAD CHLORIDE;
SILANE;
SILVER;
SILVER DERIVATIVE;
STANNOUS CHLORIDE;
SULFUR;
CHEMICAL BINDING;
CHEMICAL BOND;
COLLOID;
CONFERENCE PAPER;
ELECTROPLATING INDUSTRY;
FILM;
METAL BINDING;
PRIORITY JOURNAL;
REACTION ANALYSIS;
SENSITIZATION;
SOLID;
SURFACE PROPERTY;
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EID: 15044357451
PISSN: 09277757
EISSN: None
Source Type: Journal
DOI: 10.1016/j.colsurfa.2004.10.036 Document Type: Conference Paper |
Times cited : (41)
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References (19)
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