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Volumn 52, Issue 2, 2008, Pages 318-323
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Selective activation and electroless plating of Cu on a polyimide substrate by using a pre-patterned inhibitor layer and plasma treatments
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Author keywords
Adhesion; Copper metallization; Electroless plating; Plasma treatment; Polyimide
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Indexed keywords
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EID: 40049092750
PISSN: 03744884
EISSN: None
Source Type: Journal
DOI: 10.3938/jkps.52.318 Document Type: Article |
Times cited : (12)
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References (12)
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