메뉴 건너뛰기




Volumn 52, Issue 2, 2008, Pages 318-323

Selective activation and electroless plating of Cu on a polyimide substrate by using a pre-patterned inhibitor layer and plasma treatments

Author keywords

Adhesion; Copper metallization; Electroless plating; Plasma treatment; Polyimide

Indexed keywords


EID: 40049092750     PISSN: 03744884     EISSN: None     Source Type: Journal    
DOI: 10.3938/jkps.52.318     Document Type: Article
Times cited : (12)

References (12)


* 이 정보는 Elsevier사의 SCOPUS DB에서 KISTI가 분석하여 추출한 것입니다.