Electroless copper plating onto printed lines of nanosized silver seeds

Electrochemical and Solid-State Letters

Volumn 10, Issue 3, 2007, Pages

  Kao, Chen Yu ^a   Chou, Kan Sen ^a  

^a NATIONAL TSING HUA UNIVERSITY   (Taiwan)

Author keywords

[No Author keywords available]

Indexed keywords

ADHESION; COLLOIDS; ELECTRIC CONDUCTIVITY; ELECTROLESS PLATING; NANOSTRUCTURED MATERIALS; SILVER COMPOUNDS;

COPPER FILMS; ELECTROLESS COPPER PLATING; SILVER COLLOIDS; SURFACE DENSITY;

COPPER PLATING;

EID: 33846589361     PISSN: 10990062     EISSN: None     Source Type: Journal    
DOI: 10.1149/1.2431241     Document Type: Article

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