Selective electroless copper deposition on aluminum nitride substrate with patterned copper seed layer

Thin Solid Films

Volumn 491, Issue 1-2, 2005, Pages 18-22

  Yanagimoto, Hiroshi ^a   Deki, Shigehito ^a   Akamatsu, Kensuke ^a,c   Gotoh, Kazuo ^b  

^a KOBE UNIVERSITY   (Japan)

^b Limited   (Japan)

^c KONAN UNIVERSITY   (Japan)

Author keywords

Aluminum nitride; Copper pattern; CuO overlayer; Nanosized particles; Selective electroless deposition

Indexed keywords

ADDITIVES; ALUMINUM NITRIDE; BONDING; CHEMICAL ANALYSIS; COPPER; NANOSTRUCTURED MATERIALS; PHOTOLITHOGRAPHY;

COPPER PATTERN; CUO OVERLAYER; NANOSIZED PARTICLES; SELECTIVE ELECTROLESS DESPOSITION;

ELECTROLESS PLATING;

EID: 25144482379     PISSN: 00406090     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.tsf.2004.08.177     Document Type: Article

References (16)

1. R. Sard J. Electrochem. Soc. 117 1970 864
2. R.L. Cohen, and K.W. West J. Electrochem. Soc. 120 1973 502
3. W.T. Tseng, C.H. Lo, and S.C. Lee J. Electrochem. Soc. 148 2001 C327
4. H.H. Hsu, C.W. Teng, S.J. Lin, and J.W. Yeh J. Electrochem. Soc. 149 2002 C143
5. W.J. Dressick, C.S. Dulcey, J.H. Georger, G.S. Calabrese, and J.M. Calvert J. Electrochem. Soc. 141 1994 210
6. H. Kind, M. Geissler, H. Schmid, B. Michel, K. Kern, and E. Delamarche Langmuir 16 2000 6367
7. Y.Y. Chiang, Y.Y. Wang, and C.C. Wang J. Electron. Mater. 29 2000 1001
8. B.R. Harkness, M. Rudolph, and K. Takeuchi Chem. Mater. 14 2002 1448
9. G.M. Chow, L.K. Kurihara, D. Ma, C.R. Feng, P.E. Schoen, and L.J. Martinez-Miranda Appl. Phys. Lett. 70 1997 2315
10. A. Geith, M. Kulig, T. Hofmann, and C. Rüssel J. Mater. Sci. 28 1993 865
11. J.H. Chang, J.G. Duh, and B.S. Chiou IEEE Trans. Components Hybrids Manuf. Technol. 16 1993 1021
12. R.R. Lee J. Am. Ceram. Soc. 74 1991 2242
13. H. Yanagimoto, K. Akamatsu, S. Deki, and K. Gotoh Electrochem. Solid-State Lett. 5 2002 C87
14. H. Yanagimoto, K. Akamatsu, S. Deki, and K. Gotoh J. Electrochem. Soc. 150 2003 C260
15. H. Yanagimoto, K. Akamatsu, K. Gotoh, and S. Deki J. Mater. Chem. 11 2001 2387
16. J. Rickerby, and J.H. Steinke Chem. Rev. 102 2002 1525