Thermal imprinting of nano-patterns using thiol-based self-assembled monolayer-treated nickel template

Journal of Nanoscience and Nanotechnology

Volumn 9, Issue 7, 2009, Pages 4103-4107

  Byeon, Kyeong Jae ^a   Hwang, Seon Yong ^a   Yang, Ki Yeon ^a   Lee, Heon ^a  

^a Korea University   (South Korea)

Author keywords

Antistiction coating; Nanoimprint lithography; Ni template; Thiol based sams

Indexed keywords

ANTI-STICTION; ANTISTICTION COATING; MECHANICAL STRENGTH; NANO PATTERN; NI TEMPLATE; PREPOLYMERS; SI SUBSTRATES; SI-BASED MATERIALS; SUBMICRON; THERMAL IMPRINT; THIOL-BASED SAMS;

COATINGS; ELECTROFORMING; FRACTURE MECHANICS; GOLD; MECHANICAL PROPERTIES; NICKEL; SELF ASSEMBLED MONOLAYERS;

NANOIMPRINT LITHOGRAPHY;

EID: 70350656453     PISSN: 15334880     EISSN: None     Source Type: Journal    
DOI: 10.1166/jnn.2009.M17     Document Type: Conference Paper

References (16)

1. C.-H. Chiu, H.-L. Kuo, P.-C. Chen, C.-H. Wen, Y.-C. Liu, and H.-M. P. Chen, Appl. Phys. Lett. 88, 073509 (2006).
2. G. M. McClelland, M. W. Hart, C. T. Rettner, M. E. Best, K. R. Carter, and B. D. Terris, Appl. Phys. Lett. 81, 1483 (2002).
3. S.-W. Ahn, K.-D. Lee, J.-S. Kim, S. H. Kim, J.-D. Park, S.-H. Lee, and P.-W. Yoon, Nanotechnology 16, 1874 (2005).
4. S. M. C. Vieira, K. B. K. Teo, W. I. Milne, O. Gröning, L. Gangloff, E. Minoux, and P. Legagneux, Appl. Phys. Lett. 89, 022111 (2006).
5. C. H. Choi, M. W. Lee, B. H. O, S. G. Lee, S. G. Park, and E. H. Lee, Microelectron. Eng. 83, 1336 (2005).
6. S. Zankovych, I. Maximov, I. Shorubalko, J. Seekamp, M. Beck, S. Romanov, D. Reuter, P. Schafmeister, A. D. Wieck, J. Ahopelto, C. M. S. Torres, and L. Montelius, Microelectron. Eng. 67-68, 214 (2003).
7. L. J. Heyderman, H. Schift, C. David, B. Ketterer, M. Auf der Maur, and J. Gobrecht, Microelectron. Eng. 57-58, 375 (2001).
8. T. G. Bifano, H. E. Fawcett, and P. A. Bierden, Precision Engineering 20, 53 (1997).
9. K. Byeon, S. Hong, K. Yang, S. Ra, J. Ahn, and H. Lee, Solid Slate Phenomena 124-126, 147 (2007).
10. S. Park, H. Schift, C. Padeste, B. Schnyder, R. Kötz, and J. Gobrecht, Microelectron. Eng. 73-74, 196 (2004).
11. U. K. Sur and V. Lakshminarayanan, J. Electroanal. Chem. 565, 343 (2004).
12. K.-J. Byeon, S.-H. Hong, K.-Y. Yang, D.-K. Kim, and H. Lee, Mater. Sci. Forum 539-543, 968 (2007).
13. A. E. Moser and C. J. Eckhardt, Thin Solid Films 382, 202 (2001).
14. E. Delamarche, B. Michel, H. Kang, and Ch. Gerber, Langmuir 10, 4103 (1994).
15. H. Lee and G.-Y. Jung, Microelectron. Eng. 77, 168 (2005).
16. H. Lee and G.-Y. Jung, Microelectron. Eng. 11, 42 (2005).