IMC formation on BGA package with Sn-Ag-Cu and Sn-Ag-Cu-Ni-Ge solder balls

Journal of Alloys and Compounds

Volumn 452, Issue 2, 2008, Pages 291-297

  Lin, Kwang Lung ^a   Shih, Po Cheng ^a  

^a NATIONAL CHENG KUNG UNIVERSITY   (Taiwan)

Author keywords

Intermetallics

Indexed keywords

CRYSTAL STRUCTURE; ETCHING; SCANNING ELECTRON MICROSCOPY; TIN ALLOYS;

CROSS SECTIONS; HEXAGONAL CRYSTALS; SOLDER BALLS; SYNERGISTIC EFFECT;

SOLDERING ALLOYS;

EID: 39049123335     PISSN: 09258388     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.jallcom.2006.11.036     Document Type: Article

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