Solid solution creep behavior of Sn-xBi alloys

Metallurgical and Materials Transactions A: Physical Metallurgy and Materials Science

Volumn 30, Issue 1, 1999, Pages 115-122

  Mitlin, D ^a,b,c   Raeder, C H ^a,d   Messler Jr , R W ^a  

^a RENSSELAER POLYTECHNIC INSTITUTE   (United States)

^b LAWRENCE BERKELEY NATIONAL LABORATORY   (United States)

^c Lawrence Berkeley National Laboratory   (United States)

^d ADVANCED MICRO DEVICES   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

CREEP; DIFFUSION; METALLOGRAPHIC MICROSTRUCTURE; SOLID SOLUTIONS; STRAIN RATE; STRESSES; THERMAL EFFECTS;

CREEP RATE; SELF DIFFUSION;

TIN ALLOYS;

EID: 0032760759     PISSN: 10735623     EISSN: None     Source Type: Journal    
DOI: 10.1007/s11661-999-0199-1     Document Type: Article

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