A study of Sn-Bi-Ag-(In) lead-free solders

Journal of Materials Science

Volumn 38, Issue 6, 2003, Pages 1269-1279

  Shiue, Ren Kae ^a   Tsay, Leu Wen ^b   Lin, Chun Lun ^a   Ou, Jia Lin ^a  

^a NATIONAL DONG HWA UNIVERSITY   (Taiwan)

^b NATIONAL TAIWAN OCEAN UNIVERSITY   (Taiwan)

Author keywords

[No Author keywords available]

Indexed keywords

ADDITION REACTIONS; AGING OF MATERIALS; BISMUTH; COPPER; EUTECTICS; INDIUM; INTERFACES (MATERIALS); REACTION KINETICS; SOLDERING; TEMPERATURE; THERMAL EXPANSION; TIN ALLOYS;

INTERFACIAL REACTION; LIQUIDUS TEMPERATURE; MELTING POINT; THERMAL EXPANSION COEFFICIENTS;

SOLDERING ALLOYS;

EID: 0037444778     PISSN: 00222461     EISSN: None     Source Type: Journal    
DOI: 10.1023/A:1022822127193     Document Type: Article

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