Impression creep of monolithic and composite lead free solders

Journal of Materials Science

Volumn 42, Issue 17, 2007, Pages 7592-7600

  Muthur Srinath, Purushotham K ^a   Aswath, Pranesh B ^a  

^a UNIVERSITY OF TEXAS AT ARLINGTON   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

COPPER; CREEP; CREEP RESISTANCE; HIGH TEMPERATURE EFFECTS; STRESS ANALYSIS;

COMPOSITE SOLDERS; MONOLITHIC SOLDERS; STRESS EXPONENT;

SOLDERING ALLOYS;

EID: 34547322794     PISSN: 00222461     EISSN: 15734803     Source Type: Journal    
DOI: 10.1007/s10853-006-1326-7     Document Type: Article

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