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Volumn 21, Issue 7, 2005, Pages 861-866
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Impression creep of Sn-40Pb-2.5Sb peritectic solder alloy
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Author keywords
Activation energy; Impression creep; Sn Pb Sb solder alloy; Stress exponent
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Indexed keywords
ACTIVATION ENERGY;
CREEP;
DATA REDUCTION;
DIFFUSION;
GRAIN BOUNDARIES;
TIN ALLOYS;
VICKERS HARDNESS TESTING;
IMPRESSION CREEP;
POWER LAW STRESS;
SN-PB-SB SOLDER ALLOY;
STRESS EXPONENT;
SOLDERING ALLOYS;
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EID: 23744460699
PISSN: 02670836
EISSN: None
Source Type: Journal
DOI: 10.1179/174328405X46079 Document Type: Article |
Times cited : (22)
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References (28)
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