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Volumn 21, Issue 7, 2005, Pages 861-866

Impression creep of Sn-40Pb-2.5Sb peritectic solder alloy

Author keywords

Activation energy; Impression creep; Sn Pb Sb solder alloy; Stress exponent

Indexed keywords

ACTIVATION ENERGY; CREEP; DATA REDUCTION; DIFFUSION; GRAIN BOUNDARIES; TIN ALLOYS; VICKERS HARDNESS TESTING;

EID: 23744460699     PISSN: 02670836     EISSN: None     Source Type: Journal    
DOI: 10.1179/174328405X46079     Document Type: Article
Times cited : (22)

References (28)
  • 25
    • 0033902191 scopus 로고    scopus 로고
    • J. N. Wang: Acta Mater., 2000, 48, 1517-1531.
    • (2000) Acta Mater. , vol.48 , pp. 1517-1531
    • Wang, J.N.1


* 이 정보는 Elsevier사의 SCOPUS DB에서 KISTI가 분석하여 추출한 것입니다.