Impression creep technique - An overview

Materials Science and Engineering: A

Volumn 409, Issue 1-2, 2005, Pages 67-75

  Sastry, D H ^a  

^a INDIAN INSTITUTE OF SCIENCE   (India)

Author keywords

Creep mechanisms; Grain boundaries; Impression creep; Superplasticity; Thermal activation parameters; Weldments

Indexed keywords

GRAIN BOUNDARIES; HIGH TEMPERATURE EFFECTS; INDENTATION; POLYCRYSTALLINE MATERIALS; SINGLE CRYSTALS; STEEL; SUPERPLASTICITY; TENSILE TESTING;

CREEP MECHANISMS; IMPRESSION CREEP; THERMAL ACTIVATION PARAMETERS; WELDMENTS;

CREEP TESTING;

CREEP;

EID: 28544442845     PISSN: 09215093     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.msea.2005.05.110     Document Type: Article

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