Characterization of encapsulated micromechanical resonators sealed and coated with polycrystalline SiC

Journal of Microelectromechanical Systems

Volumn 19, Issue 2, 2010, Pages 357-366

  Yoneoka, Shingo ^a   Roper, Christopher S ^b,c   Candler, Robert N ^d   Chandorkar, Saurabh A ^a   Graham, Andrew B ^a   Provine, J ^a   Maboudian, Roya ^b   Howe, Roger T ^a   Kenny, Thomas W ^a  

^a Stanford University   (United States)

^b University of California   (United States)

^c Hughes Aircraft Co   (United States)

^d UNIVERSITY OF CALIFORNIA   (United States)

Author keywords

Frequency; Packaging; Q factor; Resonators; Silicon carbide (SiC); Stability

Indexed keywords

ANNEALING PROCESS; COMPOSITE BEAM STRUCTURES; DEVICE CHARACTERIZATION; DEVICE LAYERS; ENCAPSULATED RESONATORS; FABRICATION TECHNIQUE; FREQUENCY CHANGES; FREQUENCY DRIFTS; FREQUENCY NOISE; HERMETIC PACKAGING; INERTIAL SENSOR; MICRO ELECTRO MECHANICAL SYSTEM; MICROMECHANICAL RESONATOR; PACKAGING PERFORMANCE; PACKAGING TECHNIQUES; POLY-SIC; POLYCRYSTALLINE; POLYCRYSTALLINE SIC; Q FACTOR; Q-FACTORS; QUALITY FACTORS; RESONANT FREQUENCIES; TEMPERATURE COEFFICIENT; THEORETICAL MODELS; THIN FILM ENCAPSULATION; TUNING-FORK; YOUNG'S MODULUS;

DEPOSITION; MEMS; MICROELECTROMECHANICAL DEVICES; NATURAL FREQUENCIES; PACKAGING; Q FACTOR MEASUREMENT; RESONATORS; SILICON CARBIDE; SYSTEM STABILITY;

SEMICONDUCTING SILICON COMPOUNDS;

EID: 77950594158     PISSN: 10577157     EISSN: None     Source Type: Journal    
DOI: 10.1109/JMEMS.2010.2040460     Document Type: Article

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