Using MEMS to build the device and the package

TRANSDUCERS and EUROSENSORS '07 - 4th International Conference on Solid-State Sensors, Actuators and Microsystems

Volumn , Issue , 2007, Pages 331-334

  Kim, B ^a   Hopcroft, M ^a   Jha, C M ^d   Melamud, R ^a   Chandorkar, S ^a   Agarwal, M ^a   Chen, K L ^a   Park, W T ^a   Candler, R ^b   Yama, G ^b   Partridge, A ^c   Lutz, M ^c   Kenny, T W ^a  

^a STANFORD UNIVERSITY   (United States)

^b BOSCH RESEARCH AND TECHNOLOGY CENTER   (United States)

^c SiTime Corporation   (United States)

^d NONE

Author keywords

Accelerometer; Encapsulation; Packaging; Resonator

Indexed keywords

ACTUATORS; CHIP SCALE PACKAGES; COMPOSITE MICROMECHANICS; ELECTRONIC EQUIPMENT MANUFACTURE; ENCAPSULATION; MEMS; MICROELECTROMECHANICAL DEVICES; MICROSYSTEMS; MOLDS; OPTICAL DESIGN; SENSORS; STANDARDS; TRANSDUCERS;

ACCELEROMETER; CMOS INTEGRATION; COMPLETE SYSTEMS; INJECTION MOLDS; INTERNATIONAL CONFERENCES; MEMS DEVICES; MEMS FABRICATION; MEMS PACKAGING; PACKAGING; RESONATOR; SOLID-STATE SENSORS; WAFER-SCALE;

ELECTRONICS PACKAGING;

EID: 50049119128     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/SENSOR.2007.4300135     Document Type: Conference Paper

References (5)

1. th International Conference on Solid State Sensors, Actuators, and Microsystems, Seoul, June 2006
2. R.N. Candler, W.T. Park, H.M. Li, G. Yama, A. Partridge, M. Lutz, and T.W. Kenny, "Single Wafer Encapsulation of MEMS Devices", IEEE Trans. Advanced Packaging, 26, 227 (2003).
3. M-C.M. Lee and M.C. Wu, "3D Silicon Transformation using Hydrogen Annealing", Proceedings 2004 Solid State Sensor, Actuator, and Microsystems Workshop, Hilton Head, SC p.19 (2004).
4. W.T. Park, A. Partridge, R.N. Candler, V. Ayanoor-Vitikkate, G. Yama, M. Lutz, and T.W. Kenny, "Encapsulated Sub-Millimeter Piezoresistive Accelerometers", JMEMS 15, 507 (2006).
5. M.A. Hopcroft, B. Kim, R. Melamud, S. Chandorkar, M. Agarwal, J. Salvia, H.K. Lee, and T.W. Kenny, "A High-Stability MEMS Frequency Reference" Transducers 2007, elsewhere in this Proceedings (2007).