Morphology and long term stability of Ni/Ni interconnections based on diffusion soldering

Zeitschrift fuer Metallkunde/Materials Research and Advanced Techniques

Volumn 90, Issue 9, 1999, Pages 722-726

  Khanna, Pramod Kumar ^a,c   Dalke, Gerd ^b   Gust, Wolfgang ^c  

^a CENTRAL ELECTRONICS ENGINEERING RESEARCH INSTITUTE   (India)

^b ROBERT BOSCH GMBH   (Germany)

^c UNIVERSITY OF STUTTGART   (Germany)

Author keywords

[No Author keywords available]

Indexed keywords

ELECTRIC CONTACTS; HEAT TREATMENT; HIGH TEMPERATURE PROPERTIES; INTERMETALLICS; METALLOGRAPHIC MICROSTRUCTURE; MORPHOLOGY; OPTICAL MICROSCOPY; SCANNING ELECTRON MICROSCOPY; SOLDERED JOINTS; SOLDERING; THERMAL CYCLING; X RAY DIFFRACTION ANALYSIS;

DIFFUSION SOLDERING;

NICKEL ALLOYS;

EID: 0032642046     PISSN: 00443093     EISSN: None     Source Type: Journal    
DOI: None     Document Type: Article

References (6)

1. Cunningham, J.A.: Solid State Electronics 8 (1965) 735-745.
2. Twattes, C.J.: Int. Met. Rev. 17 (1972) 149-174.
3. Klein Wassink, R.J.: Soldering in Electronics, Electrochemical Publ., British Isles (1989).
4. Khanna, P.K.; Bhatnagar, S.K.; Dalke, G.; Brunner D.; Gust, W.: Mater. Sci. Eng. B 33 (1995) L6-9.
5. Khanna, P.K.;. Bhatnagar, S.K.; Chang, L.S.; Gust, W.: Z. Metallkd, 90 (1999) 470-474.
6. Bader, S.; Gust, W.; Hieber, H.: Acta. Metall. Mater. 43 (1995) 329-337.