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Volumn 286, Issue 1-2, 1996, Pages 213-218
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High temperature tin-copper joints produced at low process temperature for stress reduction
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Author keywords
Alloys; Copper; Deposition process; Tin
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Indexed keywords
COPPER;
INTERMETALLICS;
JOINTS (STRUCTURAL COMPONENTS);
STRESSES;
TIN;
BONDING TEMPERATURE;
STRESS REDUCTION;
TIN-COPPER JOINTS;
LAMINATING;
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EID: 0030234940
PISSN: 00406090
EISSN: None
Source Type: Journal
DOI: 10.1016/S0040-6090(95)08502-5 Document Type: Article |
Times cited : (31)
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References (19)
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