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Volumn 286, Issue 1-2, 1996, Pages 213-218

High temperature tin-copper joints produced at low process temperature for stress reduction

Author keywords

Alloys; Copper; Deposition process; Tin

Indexed keywords

COPPER; INTERMETALLICS; JOINTS (STRUCTURAL COMPONENTS); STRESSES; TIN;

EID: 0030234940     PISSN: 00406090     EISSN: None     Source Type: Journal    
DOI: 10.1016/S0040-6090(95)08502-5     Document Type: Article
Times cited : (31)

References (19)
  • 4
    • 0010517538 scopus 로고
    • T.B. Massalski and others (eds.), ASM International, Metals Park, Ohio
    • N. Saunders and A.P. Miodownik, in T.B. Massalski and others (eds.), Binary Alloy Phase Diagrams, ASM International, Metals Park, Ohio, 1990, p. 1481.
    • (1990) Binary Alloy Phase Diagrams , pp. 1481
    • Saunders, N.1    Miodownik, A.P.2


* 이 정보는 Elsevier사의 SCOPUS DB에서 KISTI가 분석하여 추출한 것입니다.