High temperature tin-copper joints produced at low process temperature for stress reduction

Thin Solid Films

Volumn 286, Issue 1-2, 1996, Pages 213-218

  Lee, Chin C ^a   Chen, Yi Chia ^a  

^a UNIVERSITY OF CALIFORNIA   (United States)

Author keywords

Alloys; Copper; Deposition process; Tin

Indexed keywords

COPPER; INTERMETALLICS; JOINTS (STRUCTURAL COMPONENTS); STRESSES; TIN;

BONDING TEMPERATURE; STRESS REDUCTION; TIN-COPPER JOINTS;

LAMINATING;

EID: 0030234940     PISSN: 00406090     EISSN: None     Source Type: Journal    
DOI: 10.1016/S0040-6090(95)08502-5     Document Type: Article

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