Kinetics of the Pd/In thin-film bilayer reaction: Implications for transient-liquid-phase wafer bonding

Journal of Electronic Materials

Volumn 30, Issue 11, 2001, Pages 1471-1475

  Quitoriano, N ^a   Wong, W S ^a,b   Tsakalakos, L ^a,c   Cho, Y ^a   Sands, T ^a  

^a Lawrence Berkeley National Laboratory   (United States)

^b PALO ALTO RESEARCH CENTER   (United States)

^c GE GLOBAL RESEARCH   (United States)

Author keywords

Indium; Intermetallic; Laser lift off; Materials integration; Palladium; Reaction kinetics; Wafer bonding

Indexed keywords

CONTAMINATION; DIFFUSION; INDIUM; INTERFACES (MATERIALS); INTERMETALLICS; PALLADIUM; REACTION KINETICS;

WAFER BONDINGS;

THIN FILMS;

EID: 0035516632     PISSN: 03615235     EISSN: None     Source Type: Journal    
DOI: 10.1007/s11664-001-0204-y     Document Type: Article

References (10)