Indium-copper multilayer composites for fluxless oxidation-free bonding

Thin Solid Films

Volumn 283, Issue 1-2, 1996, Pages 243-246

  Chen, Yi Chia ^a   Lee, Chin C ^a  

^a UNIVERSITY OF CALIFORNIA   (United States)

Author keywords

Alloys; Copper; Deposition process; Indium

Indexed keywords

ACOUSTIC MICROSCOPES; BONDING; CHEMICAL VARIABLES CONTROL; COMPOSITION; COPPER; DEPOSITION; INDIUM; INTERMETALLICS; SCANNING ELECTRON MICROSCOPY; TEMPERATURE; VACUUM APPLICATIONS; X RAY ANALYSIS;

ENERGY DISPERSIVE X RAY ANALYSIS; FLUXLESS OXIDATION FREE BONDING; REMELTING TEMPERATURES; SCANNING ACOUSTIC MICROSCOPY;

MULTILAYERS;

EID: 0030232812     PISSN: 00406090     EISSN: None     Source Type: Journal    
DOI: 10.1016/0040-6090(95)08531-9     Document Type: Article

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