Deposition of solder for micro-joining on M.E.M.S. components by means of magnetron sputerring

Surface and Coatings Technology

Volumn 142-144, Issue , 2001, Pages 813-816

  Lugscheider, E ^a   Bobzin, K ^a   Lake, M K ^a  

^a RWTH AACHEN UNIVERSITY   (Germany)

Author keywords

M.E.M.S.; Micro joining; MSIP PVD process; Solder application; TLP process

Indexed keywords

DEPOSITION; EQUIPMENT; FILM; INDUSTRIAL APPLICATION; MAGNETRON SPUTTER ION PLATING; MATERIALS; MICRO ELECTROC MECHANICAL SYSTEM; SOLDER;

BOND STRENGTH (MATERIALS); MAGNETRON SPUTTERING; MICROSTRUCTURE; SOLDERED JOINTS; SPUTTER DEPOSITION; STOICHIOMETRY; THIN FILMS;

AUTOMOTIVE CONTROL;

MICROELECTROMECHANICAL DEVICES;

SPUTTERING;

EID: 0035387326     PISSN: 02578972     EISSN: None     Source Type: Journal    
DOI: 10.1016/S0257-8972(01)01182-3     Document Type: Article

References (8)

1. Bildung intermetallischer Phasen durch isotherme Erstarrung
2. Influence of substrate temperature and deposition rate on structure of thick sputtered Cu coatings
3. Influence on apparature geometry and deposition conditions on the structure and topography of thick sputtered coatings
4. Löten in der Mikrosystemtechnik