Phase characterisation and kinetic behaviour of diffusion soldered Cu/In/Cu interconnections

Materials Science and Technology

Volumn 19, Issue 4, 2003, Pages 528-534

  Sommadossi, S ^a   Gust, W ^a   Mittemeijer, E J ^a  

^a UNIVERSITY OF STUTTGART   (Germany)

Author keywords

[No Author keywords available]

Indexed keywords

DIFFUSION; INTERMETALLICS; PHASE DIAGRAMS; SOLDERING; TRANSMISSION ELECTRON MICROSCOPY; X RAY DIFFRACTION ANALYSIS;

INTERDIFFUSION COEFFICIENTS;

COPPER ALLOYS;

COPPER; COPPER DERIVATIVE; INDIUM; METAL;

ARTICLE; CHEMICAL BOND; CHEMICAL INTERACTION; CHEMICAL REACTION KINETICS; DIFFUSION; DIFFUSION COEFFICIENT; GROWTH RATE; LIQUID; SOLID; TEMPERATURE; X RAY DIFFRACTION;

EID: 0038074241     PISSN: 02670836     EISSN: None     Source Type: Journal    
DOI: 10.1179/026708303225009706     Document Type: Article

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