Solder deposition for transient liquid phase (TLP)-bonding by MSIP-PVD-process

Surface and Coatings Technology

Volumn 174-175, Issue , 2003, Pages 704-707

  Lugscheider, E ^a   Bobzin, K ^a   Erdle, A ^a  

^a RWTH AACHEN UNIVERSITY   (Germany)

Author keywords

Low temperature deposition; Magnetron sputter ion plating physical vapour deposition process; Micro electro mechanical systems; Micro joining; Solder application; Transient liquid phase process

Indexed keywords

CERAMIC MATERIALS; CHEMICAL BONDS; CHEMICAL VAPOR DEPOSITION; LOW TEMPERATURE OPERATIONS; PLASTICS; SOLDERING;

SOLDER DEPOSITION;

SURFACE CHEMISTRY;

COATING; INDUSTRIAL APPLICATION; PLASMA; SURFACE PROPERTY;

EID: 0041326634     PISSN: 02578972     EISSN: None     Source Type: Journal    
DOI: 10.1016/S0257-8972(03)00692-3     Document Type: Article

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