Solid-state and liquid-state interfacial reactions between Sn-based solders and single crystal Ag substrate

Journal of Alloys and Compounds

Volumn 469, Issue 1-2, 2009, Pages 207-214

  Zou, H F ^a   Zhang, Z F ^a  

^a INSTITUTE OF METAL RESEARCH   (China)

Author keywords

Ag single crystal substrate; Growth kinetics; Intermetallic compounds (IMCs); Lead free solder; Local cracks

Indexed keywords

BIOACTIVITY; BRAZING; CHEMICAL COMPOUNDS; CHEMICAL REACTIONS; COPPER; GROWTH (MATERIALS); GROWTH KINETICS; INTERMETALLICS; LEAD; LEAD ALLOYS; LEAD COMPOUNDS; PHASE DIAGRAMS; PHASE INTERFACES; REACTION KINETICS; SEMICONDUCTING INTERMETALLICS; SILVER; SINGLE CRYSTALS; SOLDERED JOINTS; SOLDERING ALLOYS; SOLID STATE REACTIONS; SUBSTRATES; SUPERCONDUCTING MATERIALS; WELDING;

AG SINGLE CRYSTAL SUBSTRATE; AG SUBSTRATES; AGING CONDITIONS; AGING TIMES; DIFFUSION COEFFICIENTS; INTERFACIAL MORPHOLOGIES; INTERFACIAL REACTIONS; INTERMETALLIC COMPOUNDS (IMCS); LEAD-FREE SOLDER; LOCAL CRACKS; SMALL CRACKS; SN-37PB; SOLDER JOINTS;

TIN;

EID: 58249134982     PISSN: 09258388     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.jallcom.2008.01.082     Document Type: Article

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