Evolution of Ag3Sn during reflow soldering

Thermomechanical Phenomena in Electronic Systems -Proceedings of the Intersociety Conference

Volumn 2, Issue , 2004, Pages 116-120

  Chung, C Key ^a   Tai, Siew Fong ^a  

^a Intel Technology Malaysia Sdn Bhd   (Malaysia)

Author keywords

Ag3Sn platelets; During reflow soldering

Indexed keywords

AG3SN PLATELETS; DURING REFLOW SOLDERING; ORGANIC SOLDERABLE PRESERVATIVE (OSP); SOLID-STATE AGEING;

ELECTRONIC EQUIPMENT; INTERFACES (MATERIALS); INTERMETALLICS; MICROSTRUCTURE; NICKEL; SCANNING ELECTRON MICROSCOPY; SOLDERING; SURFACE TREATMENT; THERMAL EXPANSION; TRANSMISSION ELECTRON MICROSCOPY;

SILVER COMPOUNDS;

EID: 4444337085     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

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