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Volumn 200, Issue 1-4 SPEC. ISS., 2005, Pages 444-447
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Advancement in low melting solder deposition by pulsed Magnetron Sputter-PVD process for microsystemtechnology
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Author keywords
Low temperature deposition; Micro joining; Pulsed MS PVD process; Solder application
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Indexed keywords
COPPER ALLOYS;
INDENTATION;
JOINING;
LOW TEMPERATURE EFFECTS;
MAGNETRON SPUTTERING;
MELTING;
METALLOGRAPHIC MICROSTRUCTURE;
MICROELECTROMECHANICAL DEVICES;
PHYSICAL VAPOR DEPOSITION;
SCANNING ELECTRON MICROSCOPY;
SPUTTER DEPOSITION;
TEMPERATURE CONTROL;
LOW TEMPERATURE DEPOSITION;
MICRO-JOINING;
PULSED PHYSICAL VAPOR DEPOSITION PROCESS;
SOLDER APPLICATION;
SOLDER DEPOSITION;
SOLDERING ALLOYS;
SOLDER;
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EID: 24644459826
PISSN: 02578972
EISSN: None
Source Type: Journal
DOI: 10.1016/j.surfcoat.2005.02.193 Document Type: Article |
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Times cited : (12)
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References (6)
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