Deposition and etching of fluorocarbon thin films in atmospheric pressure DBDs fed with Ar-CF4-H2 and Ar-CF4-O2 mixtures

Surface and Coatings Technology

Volumn 204, Issue 11, 2010, Pages 1779-1784

  Fanelli, Fiorenza ^a   Fracassi, Francesco ^a   d'Agostino, Riccardo ^a  

^a CNR   (Italy)

Author keywords

Atmospheric pressure cold plasma; Dielectric barrier discharge; Etching; Fluorocarbon film; Plasma enhanced chemical vapour deposition

Indexed keywords

CHEMICAL VAPOUR DEPOSITION; COLD PLASMAS; DIELECTRIC BARRIER DISCHARGE; FLUOROCARBON FILM; FLUOROCARBON FILMS;

ARGON; ATMOSPHERIC CHEMISTRY; ATMOSPHERIC PRESSURE; CHEMICAL VAPOR DEPOSITION; DIELECTRIC DEVICES; ELECTRIC DISCHARGES; ETCHING; FLOW CONTROL; FLUORINE; FLUORINE CONTAINING POLYMERS; ION BOMBARDMENT; MIXTURES; ORGANIC POLYMERS; OXYGEN; PHOTORESISTS; PLASMA DEPOSITION; PLASMA INTERACTIONS; THIN FILMS;

DEPOSITION;

EID: 74849088506     PISSN: 02578972     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.surfcoat.2009.11.011     Document Type: Article

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