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Volumn 203, Issue 9, 2009, Pages 1231-1236
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Plasma enhanced CVD of fluorocarbon films by low-pressure dielectric barrier discharge
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Author keywords
Dielectric barrier discharge; Fluorocarbon films; Plasma deposition
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Indexed keywords
ANGLE MEASUREMENT;
ATOMIC FORCE MICROSCOPY;
ATOMIC SPECTROSCOPY;
CONTACT ANGLE;
DIELECTRIC DEVICES;
ELECTRIC DISCHARGES;
ELECTRIC POWER DISTRIBUTION;
ELECTRIC POWER TRANSMISSION NETWORKS;
ELECTRIC POWER UTILIZATION;
ELECTRODEPOSITION;
FLOW CONTROL;
NANOFLUIDICS;
PHOTOELECTRON SPECTROSCOPY;
PLASMA ENHANCED CHEMICAL VAPOR DEPOSITION;
PLASMAS;
SCANNING ELECTRON MICROSCOPY;
SURFACE ROUGHNESS;
X RAY PHOTOELECTRON SPECTROSCOPY;
ATOMIC FORCES;
CROSS-LINKED STRUCTURES;
DEPOSITED FILMS;
DEPOSITION PRESSURES;
DIELECTRIC BARRIER DISCHARGE;
DISCHARGE PRESSURES;
FILM QUALITIES;
FLUOROCARBON FILMS;
HIGH PRESSURES;
HYDROPHOBIC PROPERTIES;
PLASMA PARAMETERS;
PLASMA-ENHANCED CVD;
POWER SUPPLIES;
PRESSURE DIELECTRIC BARRIER DISCHARGES;
SCANNING ELECTRONS;
SILICON SUBSTRATES;
STATIC CONTACT ANGLES;
UNIFORM MICROSTRUCTURES;
X-RAY PHOTOELECTRON SPECTROSCOPIES;
PLASMA DEPOSITION;
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EID: 58849138725
PISSN: 02578972
EISSN: None
Source Type: Journal
DOI: 10.1016/j.surfcoat.2008.10.023 Document Type: Article |
Times cited : (20)
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References (28)
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