Various shapes of silicon freestanding microfluidic channels and microstructures in one-step lithography

Journal of Micromechanics and Microengineering

Volumn 19, Issue 5, 2009, Pages

  Pal, Prem ^a   Sato, Kazuo ^a  

^a NAGOYA UNIVERSITY   (Japan)

Author keywords

[No Author keywords available]

Indexed keywords

COMPLEMENTARY METAL OXIDE SEMICONDUCTORS; CONCAVE CORNERS; DIRECT WAFER BONDING; FABRICATION METHOD; FABRICATION PROCESS; INTERMEDIATE LAYERS; LOCAL OXIDATION; MASK DESIGN; MICROFLUIDIC CHANNEL; POST PROCESS; SHAPE AND SIZE; SILICON ANISOTROPIC ETCHING; STEP LITHOGRAPHY; TETRAMETHYL AMMONIUM HYDROXIDE; TRITON-X; WET ANISOTROPIC ETCHING;

AMMONIUM COMPOUNDS; ANISOTROPY; FABRICATION; FLUIDIC DEVICES; LITHOGRAPHY; MICROFLUIDICS; MICROSTRUCTURE; SEMICONDUCTING SILICON COMPOUNDS; SILICON NITRIDE; SILICON WAFERS; SURFACE ACTIVE AGENTS; WAFER BONDING; WET ETCHING;

ANISOTROPIC ETCHING;

EID: 70349970562     PISSN: 09601317     EISSN: 13616439     Source Type: Journal    
DOI: 10.1088/0960-1317/19/5/055003     Document Type: Article

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