Interface study of bonded wafers by digitized linear frequency modulated thermal wave imaging

Sensors and Actuators, A: Physical

Volumn 128, Issue 1, 2006, Pages 209-216

  Mulaveesala, Ravibabu ^a   Pal, Prem ^a,b   Tuli, Suneet ^a,c  

^a INDIAN INSTITUTE OF TECHNOLOGY DELHI   (India)

^b Yonsei University   (South Korea)

^c CARE ^*

Author keywords

Direct wafer bonding; Frequency modulations; Interface characterization; Thermal wave; Thermography

Indexed keywords

DIRECT WAFER BONDING; INTERFACE CHARACTERIZATION; PHASE IMAGES; THERMAL WAVE;

ANISOTROPY; ANNEALING; ETCHING; FREQUENCY MODULATION; MICROELECTROMECHANICAL DEVICES; SEMICONDUCTOR MATERIALS; THERMOGRAPHY (IMAGING); VLSI CIRCUITS;

WSI CIRCUITS;

EID: 33645166212     PISSN: 09244247     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.sna.2006.01.004     Document Type: Article

References (25)

1. Q.Y. Tong, and U. Gosele Semiconductor Wafer Bonding 1999 John Wiley and Sons Inc.
2. A. Ayon, X. Zhang, K. Turner, D. Choi, B. Miller, S.F. Nagle, and S.M. Spearing Characterization of silicon wafer bonding for power MEMS applications Sens. Actuators A 103 2003 1 8
3. M.A. Schmidt Wafer-to-wafer bonding for microstructure formation IEEE Proc. 86 1998 1575 1585
4. K. Petersen, P. Barth, J. Poydock, J. Brown, J. Mallon, and J. Bryzek Silicon fusion bonding for pressure sensor IEEE Solid State Sensor and Actuator Workshop Hilton Head, SC 1988 144 147
5. X. Jin, I. Ladabaum, and B.T. Khuri-Yakub The microfabrication of capacitive ultrasonic transducers J. Microelectromech. Syst. 7 1998 295 302
6. M.A. Huff, A.D. Nikolich, and M.A. Schmidt A threshold pressure switch utilizing plastic deformation of silicon International Conference on Solid State Sensors and Actuators San Francisco 1991 177 180
7. Y. Huang, A.S. Ergun, E. Haeggstrom, M.H. Badi, and B.T. Khuri-Yakub Fabricating capacitive micromachined ultrasonic transducers with wafer-bonding technology J. Microelectromech. Syst. 12 2003 128 137
8. M.A. Huff, A.D. Nikolich, and M.A. Schmidt Design of sealed cavity microstructures formed by silicon wafer bonding J. Microelectromech. Syst. 2 1993 74 81
9. M.A. Huff, and M.A. Schmidt Fabrication, packaging, and testing of a wafer-bonded microvalve IEEE Solid State Sensor and Actuator Workshop Hilton Head, SC 1992 194 197
10. J. Shajii, K.Y. Ng, and M.A. Schmidt A microfabricated floating element shear stress sensor using wafer bonding technology J. Microelectromech. Syst. l 1992 89 94
11. P.W. Barth, F. Pourahmadi, R. Mayer, J. Poydock, and K. Petersen A monolithic silicon accelerometer with integral air damping and over range protection IEEE Solid State Sensor and Actuator Workshop Hilton Head, SC 1988 35 38
12. S. Terry A miniature silicon accelerometer with built-in damping IEEE Solid State Sensor and Actuator Workshop Hilton Head, SC 1988 114 116
13. C.T. Pan, P.J. Cheng, M.F. Chen, and C.K. Yen Intermediate wafer level bonding and interface behavior Microelectron. Reliab. 45 3-4 2005 657 663
14. M.A. Schmidt Wafer-to-wafer bonding for microstructure formation Proc. IEEE 86 8 1998 1575 1580
15. L. Dozsa, B. Szentpali, D. Pasquariello, and K. Hjort Point defects generated by direct-wafer bonding of silicon J. Electron. Mater. 31 2 2002 113 118
16. X.P.V. Maldague Theory and Practice of Infrared Thermography for Non-destructive Testing 2004 John Wiley and Sons Inc.
17. D. Wu, and G. Busse Lock-in thermography for non-destructive evaluation of materials Rev. Gen. Therm. 1998 693 703
18. X.P.V. Maldague, F. Glmiche, and A. Ziadi Advances in pulse phase thermography Infrared Phys. Technol. 43 2002 175 181
19. R. Mulaveesala, and S. Tuli Implementation of frequency modulated thermal wave imaging for non-destructive subsurface defect detection Insight 47 2005 206 208
20. S. Tuli, and R. Mulaveesala Defect detection by pulse compression in frequency modulated thermal wave imaging QIRT J. 2 1 2005 41 54
21. R. Mulaveesala, and S. Tuli Digitized frequency modulated thermal wave imaging for non-destructive testing Mater. Eval. 63 10 2005 1046 1050
22. H.S. Carlslaw, and J.C. Jaeger Conduction of Heat in Solids 1959 Oxford University Press New York
23. 3 form laser induced pyroelectric signals Electron. Lett. 29 3 1993 708 710
24. W. Kern, and D.A. Puotinen Cleaning solutions based on hydrogen peroxide for use in silicon semiconductor technology RCA Rev. 31 1970 187 206
25. S. Tuli, A.B. Bhattacharyya, B.C. Forget, and D. Fournier Mirage-effect-based depth profiling of micromachined silicon structure Sens. Actuators A: Phys. A 64 1998 203 207