Design and development of microstructures for MEMS applications

Proceedings of SPIE - The International Society for Optical Engineering

Volumn 3226, Issue , 1997, Pages 22-30

  Chandra, Sudhir ^a   Singh, Janak ^a   Chand, Ami ^a,b  

^a Centre for Applied Research in Electronics   (India)

^b UNIVERSITY OF CALIFORNIA   (United States)

Author keywords

Bulk and surface micromachining technology; MEMS; Suspended microstructures; Wafer bonding

Indexed keywords

ANNEALING; BONDING; BORON; COMPOSITE MICROMECHANICS; ELECTROSTATIC ACTUATORS; MACHINING; MEMS; MICROELECTROMECHANICAL DEVICES; MICROELECTRONIC PROCESSING; MICROMACHINING; MICROMECHANICS; MICROSTRUCTURE; NANOCANTILEVERS; POLYSILICON; RAPID THERMAL ANNEALING; RAPID THERMAL PROCESSING; SEMICONDUCTING SILICON COMPOUNDS; SILICON WAFERS; SURFACE MICROMACHINING; TECHNOLOGY;

BULK AND SURFACE MICROMACHINING TECHNOLOGY; BULK SILICON MICROMACHINING; CONVENTIONAL FURNACE ANNEALING; DEPOSITION PARAMETERS; DESIGN AND DEVELOPMENTS; DIELECTRIC LAYERS; DIRECT WAFER BONDINGS; ELECTROSTATIC ACTUATIONS; HEAVILY BORON DOPED; LOW STRESSES; MEASURED VALUES; MEMS APPLICATIONS; NEW APPROACHES; PHYSICAL PARAMETERS; POLYSILICON FILMS; POST DEPOSITIONS; SUSPENDED MICROSTRUCTURES;

WAFER BONDING;

EID: 10444252236     PISSN: 0277786X     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1117/12.284571     Document Type: Conference Paper

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