RF sputtered silicon for MEMS

Journal of Micromechanics and Microengineering

Volumn 15, Issue 8, 2005, Pages 1536-1546

  Pal, Prem ^a   Chandra, Sudhir ^a  

^a INDIAN INSTITUTE OF TECHNOLOGY DELHI   (India)

Author keywords

[No Author keywords available]

Indexed keywords

BONDING; ELECTROMAGNETIC WAVE DIFFRACTION; LOW TEMPERATURE EFFECTS; SILICON ON INSULATOR TECHNOLOGY; SILICON WAFERS; SPUTTER DEPOSITION; SURFACE ROUGHNESS; THIN FILMS;

DEPOSITION PARAMETERS; OXIDIZED STRUCTURES; SILICON FILMS; WAFER BONDING;

MICROELECTROMECHANICAL DEVICES;

EID: 22544468878     PISSN: 09601317     EISSN: None     Source Type: Journal    
DOI: 10.1088/0960-1317/15/8/023     Document Type: Article

References (31)

1. Gad-el-Hak M (ed) 2002 The MEMS Handbook (Boca Raton, FL: CRC Press LLC)
2. Kovacs G T, Maluf N I and Petersen K E 1998 Bulk micromachining of silicon IEEE Proc. 86 1536-51
3. Bustillo J M, Howe R T and Muller R S 1998 Surface micromachining for micro-electromechanical systems IEEE Proc. 86 1552-73
4. Honer K A and Kovacs G T 2001 Integration of sputtered silicon microstructures with pre-fabricated CMOS circuitry Sensors Actuators A 91 386-97
5. Howe R T and Muller R S 1983 Polycrystalline and amorphous silicon micromechanical beams: annealing and mechanical properties Sensors Actuators A 4 447-54
6. Frederico S, Hibert C, Fritschi R, Fluckiger P, Renaud P and Ionescu A M 2003 Silicon sacrificial layer dry etching (SSLDE) for free-standing RF MEMS architectures Proc. 16th IEEE Int. Conf. on Micro Mechanical Systems (Kyoto, Japan) pp 570-3
7. Yang X, Tai Y-C and Ho C-M 1997 Micro bellow actuators Int. Conf. on Solid-State Sensors and Actuators (Transducers '97) (Chicago, IL) pp 45-8
8. Jin X, Ladabaum I and Khuri-Yakub B T 1998 The microfabrication of capacitive ultrasonic transducers J. Microelectromech. Syst. 7 295-302
9. Guckel H and Burns D W 1984 Planar processed polysilicon sealed cavities for pressure transducer arrays IEEE Int. Electron Devices Meeting (IEDM-86) pp 223-5
10. Fischer M, Nägele M, Eichner D, Schöllhorn C and Strobel R 1996 Integration of surface-micromachined polysilicon mirrors and a standard CMOS process Sensors Actuators A 52 140-4
11. French P J, Drieenhuizen B P, Poenar D, Goosen J F L, Mallee R, Sarro P M and Wolffenbuttel R F 1996 The development of a low stress polysilicon process compatible with standard device processing J. Microelectromech. Syst. 5 187-96
12. Singh J, Chandra S and Chand A 1999 Strain studies in LPCVD polysilicon for surface micromachined devices Sensors Actuators A 77 133-8
13. Bustillo J M, Fedder G K, Nguyen C T-C and Howe R T 1994 Process technology for the modular integration of CMOS and microstructures Microsyst. Technol. 1 30-41
14. Tong Q Y and Gosele U 1999 Semiconductor Wafer Bonding (New York: Wiley)
15. Ayón A, Zhang X, Turner K, Choi D, Miller B, Nagle S F and Spearing S M 2003 Characterization of silicon wafer bonding for power MEMS applications Sensors Actuators A 103 1-8
16. Schmidt M A 1998 Wafer-to-wafer bonding for microstructure formation IEEE Proc. 86 1575-85
17. Hurley R E and Gamble H S 2003 Thin film sputtered silicon for silicon wafer bonding applications Vacuum 70 131-40
18. Kim B H, Chung T D, Lee J W, Lee Y J and Chun K 1998 Amorphous silicon direct bonding (a-SDB) with improved surface roughness J. Korean Phys. Soc. 33 S450-3
19. Huff M A, Nikolich A D and Schmidt M A 1991 A threshold pressure switch utilizing plastic deformation of silicon Int. Conf. on Solid State Sensors and Actuators (San Francisco, CA) pp 177-80
20. Huang Y, Ergun A S, Haeggstrom E, Badi M H and Khuri-Yakub B T 2003 Fabricating capacitive micromachined ultrasonic transducers with wafer-bonding technology J. Microelectromech. Syst. 12 128-37
21. Huff M A, Nikolich A D and Schmidt M A 1993 Design of sealed cavity microstructures formed by silicon wafer bonding J. Microelectromech. Syst. 2 74-81
22. Ohring M 1991 The Material Science of Thin Film (New York: Academic)
23. Zou J, Balberg M, Byrne C, Liu C and Brady D J 1999 Optical properties of surface micromachined mirrors with etch holes J. Microelectromech. Syst. 8 506-13
24. Hetherington D L and Sniegowski J J 1998 Improved polysilicon surface-micromachined micromirror devices using chemical-mechanical polishing Proc. SPIE 3440 148-53
25. Petkov P, Wuttig M, Ilchev P and Petkova T 2003 Optical band gap of gallium containing telluride thin films J. Optoelectron. Adv. Mater. 5 1101-6
26. Achiq A, Rizk R, Madelon R, Gourbilleau F and Voivenel P 1999 Effects of pre-hydrogenation on the relaxation and bandgap variation of thermally nanocrystallized silicon layers Phil. Mag. B 79 777-91
27. Richards B S, Lambertz A and Sproul A B 1998 Optical characterisation of sputtered silicon thin films on glass 2nd WCPEC (Vienna, Austria) pp 1294-7
28. Schoenfeld O, Zhao X, Hempel T and Aoyagi Y 1994 Optical, electrical and structural investigations of the transition from amorphous to microcrystalline silicon Japan. J. Appl. Phys. 33 6082-5
29. Thornton J A and Hoffman D W 1989 Stress-related effects in thin films Thin Solid Films 171 5-31
30. Papapolymerou I, Drayton R F and Katehi L P B 1998 Micromachined patch antennas IEEE Trans. Antennas Propag. 46 275-83
31. Robertson S V, Katehi L P B and Rebeiz G M 1996 Micromachined W-band filters IEEE Trans. Microw. Theory Tech. 44 598-606