Suspended Si microstructures over controlled depth micromachined cavities for MEMS based sensing devices

Sensor Letters

Volumn 7, Issue 1, 2009, Pages 11-16

  Pal, Prem ^a   Sato, Kazuo ^a  

^a NAGOYA UNIVERSITY   (Japan)

Author keywords

MEMS; Silicon direct wafer bonding; Surfactant; TMAH; Wet anisotropic etching

Indexed keywords

CONCAVE CORNERS; CONVEX CORNERS; CRYSTALLOGRAPHIC PLANE; CURVED SHAPES; DIRECT WAFER BONDING; ETCH DEPTH; ETCH RATES; FABRICATION METHOD; FABRICATION PROCESS; LOW LEVEL; MICROMACHINED; SENSING DEVICES; SILICON MICROSTRUCTURES; SURFACTANT; TETRAMETHYL AMMONIUM HYDROXIDE; TMAH; TRITON-X; WATER SOLUTIONS; WET ANISOTROPIC ETCHING;

AMMONIUM COMPOUNDS; ANISOTROPY; DRY ETCHING; ETHYLENE GLYCOL; IONIZATION OF LIQUIDS; MEMS; MICROELECTROMECHANICAL DEVICES; MICROSTRUCTURE; PHOTORESISTS; POLYETHYLENE GLYCOLS; POLYETHYLENE OXIDES; SEMICONDUCTING SILICON COMPOUNDS; SENSORS; SILICON WAFERS; SINGLE CRYSTALS; SURFACE ACTIVE AGENTS; WAFER BONDING; WET ETCHING;

ANISOTROPIC ETCHING;

EID: 67649209012     PISSN: 1546198X     EISSN: None     Source Type: Journal    
DOI: 10.1166/sl.2009.1003     Document Type: Article

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