Silicon microstructuring technology

Materials Science and Engineering R: Reports

Volumn 17, Issue 1, 1996, Pages 1-55

  Lang, Walter ^a,b  

^a Institute for Micromachining and Information Technology   (Germany)

^b Fraunhofer Institut fur Festkorpertechnologie   (Germany)

Author keywords

Actuators; Microstructures; Microsystems; Sensors; Silicon micromachining

Indexed keywords

ACTUATORS; DRY ETCHING; MICROELECTROMECHANICAL DEVICES; MICROELECTRONICS; MICROMACHINING; MICROSTRUCTURE; PHYSICAL PROPERTIES; POROUS SILICON; REACTIVE ION ETCHING; SILICON SENSORS; THERMODYNAMIC PROPERTIES; THREE DIMENSIONAL;

ANISOTROPIC ETCHING; ELECTROCHEMICAL ETCH STOP; MICROSYSTEMS; PIEZORESISTIVE COEFFICIENT; POROUS SILICON TECHNOLOGY; PULSED POTENTIAL ETCH STOP; SILICON FUSION BONDING TECHNOLOGY; SILICON MICROSTRUCTURING TECHNOLOGY; SPUTTER ETCHING; SURFACE MICROMACHINING;

SILICON ON INSULATOR TECHNOLOGY;

EID: 0030243326     PISSN: 0927796X     EISSN: None     Source Type: Journal    
DOI: 10.1016/0927-796X(96)00190-8     Document Type: Review

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