Fabrication and performance of mems-based pressure sensor packages using patterned ultra-thick photoresists

Sensors

Volumn 9, Issue 8, 2009, Pages 6200-6218

  Chen, Lung Tai ^a,b   Chang, Jin Sheng ^a   Hsu, Chung Yi ^a   Cheng, Wood Hi ^b  

^a INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE   (Taiwan)

^b NATIONAL SUN YAT SEN UNIVERSITY   (Taiwan)

Author keywords

Packaging; Photoresist; Pressure sensor

Indexed keywords

HIGH TEMPERATURE COEFFICIENT; PIEZORESISTIVE PRESSURE SENSORS; PLASTIC PACKAGING; THERMAL SIGNALS; THIN SILICON MEMBRANE;

FINITE ELEMENT METHOD; PACKAGING; PHOTORESISTS; THERMAL STRESS;

PRESSURE SENSORS;

EID: 70349792231     PISSN: 14248220     EISSN: None     Source Type: Journal    
DOI: 10.3390/s90806200     Document Type: Article

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