Realization of electroplating molds with thick positive SPR 220-7 photoresist

Journal of Materials Science: Materials in Electronics

Volumn 14, Issue 5-7, 2003, Pages 319-322

  Kukharenka, E ^a   Kraft, M ^a  

^a UNIVERSITY OF SOUTHAMPTON   (United Kingdom)

Author keywords

[No Author keywords available]

Indexed keywords

ELECTRIC INDUCTORS; ELECTRIC TRANSFORMERS; ELECTROPLATING; EPOXY RESINS; MICROMACHINING; MOLDS;

ELECTROPLATING MOLDS; MICROMACHINED HIGH DENSITY CURRENT CARRYING WIRES; NEGATIVE EPOXY BASED PHOTORESIST;

PHOTORESISTS;

EID: 0038487752     PISSN: 09574522     EISSN: None     Source Type: Journal    
DOI: 10.1023/A:1023923911921     Document Type: Article

References (9)

1. http://www.shipley.com/.
2. N. Elejalde, F. Y. Orgin and S. L. Lee, Proc. MME A2 (2001) 11.
3. H. Lorenz, M. Laudon and P. Renaud, Microelectron. Eng. 41/42 (1998) 371.
4. B. Eyre, J. Blosiu and D. Wiberg, Proceedings, MEMS'98 (IEEE, Heidelberg, 1998) p. 218.
5. P. Folman Kruger, D. Cassettari, B. Hessmo, T. Maier and J. Schmiedmayer, Phys. Rev. Lett. 48 (2000) 20, 47.
6. E. A. Hinds, C. J. Vale and M. G. Boshier, ibid. 86 (2001) 1462.
7. L. Dellmann, S. Roth, C. Beuret, G.-A. Racine and H. Lorenz, Proc. Transducer (1997) 641.
8. L. Guerin, A. Torosdagi, P. Eichenberger and P. Renaud, Proc. Eurosensors (1998) 11.
9. S.-H. Kim, S.-H. Lee and Y.-K. Kim, Transducers (1999) 110.