Analysis of the packaging stresses in monolithic multi-sensor

Proceedings of the 2nd IEEE International Conference on Nano/Micro Engineered and Molecular Systems, IEEE NEMS 2007

Volumn , Issue , 2007, Pages 241-244

  Xu, Jingbo ^a   Zhao, Yulong ^a   Jiang, Zhuangde ^a  

^a XI'AN JIAOTONG UNIVERSITY   (China)

Author keywords

COB; FEM; MEMS; Multi sensor; Package

Indexed keywords

ELECTRONICS PACKAGING; FINITE ELEMENT METHOD; STRESS ANALYSIS;

MULTISENSOR CHIPS; PACKAGED MONOLITHIC MULTISENSORS;

SENSOR DATA FUSION;

EID: 34548126911     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/NEMS.2007.352271     Document Type: Conference Paper

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