Packaging effect investigation of CMOS compatible pressure sensor using flip chip and flex circuit board technologies

Sensors and Actuators, A: Physical

Volumn 126, Issue 1, 2006, Pages 48-55

  Lee, Chang Chun ^a   Peng, Chih Tang ^a   Chiang, Kuo Ning ^a  

^a NATIONAL TSING HUA UNIVERSITY   (Taiwan)

Author keywords

Finite element method (FEM); Package; Piezoresistive pressure sensor

Indexed keywords

CMOS INTEGRATED CIRCUITS; ELECTRONICS PACKAGING; FINITE ELEMENT METHOD; MICROPROCESSOR CHIPS; PRESSURE EFFECTS; SENSITIVITY ANALYSIS; THERMAL EXPANSION;

PACKAGE; PIEZORESISTIVE PRESSURE SENSORS; SMALL OUTLINE PACKAGE (SOP);

SENSORS;

EID: 31044449217     PISSN: 09244247     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.sna.2005.09.018     Document Type: Article

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