메뉴 건너뛰기




Volumn 44, Issue 12, 2004, Pages 1995-2002

Finite element simulation of package stress in transfer molded MEMS pressure sensors

Author keywords

[No Author keywords available]

Indexed keywords

EPOXY RESINS; FINITE ELEMENT METHOD; INTEGRATED CIRCUITS; PRESSURE MEASUREMENT; SENSORS; STRESS ANALYSIS; TEMPERATURE DISTRIBUTION; TRANSFER MOLDING;

EID: 6344294154     PISSN: 00262714     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.microrel.2004.05.020     Document Type: Conference Paper
Times cited : (51)

References (15)
  • 1
    • 0012104584 scopus 로고    scopus 로고
    • Multichip module packaging of microelectromechanical systems
    • Butler J.T., Bright V.M., Comtois J.H. Multichip module packaging of microelectromechanical systems. Sens. Actuators. A70:1998;15-22.
    • (1998) Sens. Actuators , vol.A70 , pp. 15-22
    • Butler, J.T.1    Bright, V.M.2    Comtois, J.H.3
  • 4
    • 0032092118 scopus 로고    scopus 로고
    • Measurement of package-induced stress and thermal zero shift in transfer molded silicon piezoresistive pressure sensors
    • Nysaether J.B., Larsen A., Liverod B., Ohlckers P. Measurement of package-induced stress and thermal zero shift in transfer molded silicon piezoresistive pressure sensors. J. Micromech. Microeng. 8:1998;168-171.
    • (1998) J. Micromech. Microeng. , vol.8 , pp. 168-171
    • Nysaether, J.B.1    Larsen, A.2    Liverod, B.3    Ohlckers, P.4
  • 5
    • 0032083671 scopus 로고    scopus 로고
    • Analysis of thermomechanical stresses in a 3D packaged micro electron mechanical system
    • Pellet C., Lecouvé M., Frémont H., Val A., Estéve D. Analysis of thermomechanical stresses in a 3D packaged micro electron mechanical system. Microelectron. Reliability. 38:1998;1261-1264.
    • (1998) Microelectron. Reliability , vol.38 , pp. 1261-1264
    • Pellet, C.1    Lecouvé, M.2    Frémont, H.3    Val, A.4    Estéve, D.5
  • 6
    • 0034960338 scopus 로고    scopus 로고
    • Low stress packaging of a micromachined accelerometer
    • Li G., Tseng A.A. Low stress packaging of a micromachined accelerometer. IEEE Trans. Electron. Packaging Manuf. 24(1):2001;18-25.
    • (2001) IEEE Trans. Electron. Packaging Manuf. , vol.24 , Issue.1 , pp. 18-25
    • Li, G.1    Tseng, A.A.2
  • 7
    • 0030700972 scopus 로고    scopus 로고
    • Packaging for microengineered devices. Lessons from the real world
    • London, UK: Assembly Connections Microsyst.
    • Beardmore G. Packaging for microengineered devices. Lessons from the real world. Proc. Inst. Elec. Eng. Colloq. London, UK: Assembly Connections Microsyst.; 1997. p. 2/1-2/8.
    • (1997) Proc. Inst. Elec. Eng. Colloq.
    • Beardmore, G.1
  • 8
    • 6344283682 scopus 로고    scopus 로고
    • CINDAS. Purdue University, Lafayette, IN
    • CINDAS, SRC Document. Purdue University, Lafayette, IN; 1999.
    • (1999) SRC Document
  • 12
    • 6344290650 scopus 로고    scopus 로고
    • Direct calculation of sensor performance in a FEA Model
    • Orlando, FL; June
    • Krondorfer RH, Lommasson TC. Direct calculation of sensor performance in a FEA Model, Proc. 1st Sens. Conf., Orlando, FL, 2002; June: p. 219-225.
    • (2002) Proc. 1st Sens. Conf. , pp. 219-225
    • Krondorfer, R.H.1    Lommasson, T.C.2
  • 13
    • 0026417488 scopus 로고
    • The mechanism for occurrence of internal stress during curing epoxide resins
    • Ochi M., Tamashita K., Shimbo M. The mechanism for occurrence of internal stress during curing epoxide resins. J. Appl. Polym. Sci. 43:1991;2013-2019.
    • (1991) J. Appl. Polym. Sci. , vol.43 , pp. 2013-2019
    • Ochi, M.1    Tamashita, K.2    Shimbo, M.3
  • 14
    • 3743089513 scopus 로고    scopus 로고
    • Effects of temperature and moisture upon the mechanical behaviour of an epoxy moulding compound
    • ASME
    • Harper B.D., Lu L., Kenner V.H. Effects of temperature and moisture upon the mechanical behaviour of an epoxy moulding compound. Adv. Electron. Packaging. 19-1:1997;1207-1212. ASME.
    • (1997) Adv. Electron. Packaging , vol.19 , Issue.1 , pp. 1207-1212
    • Harper, B.D.1    Lu, L.2    Kenner, V.H.3


* 이 정보는 Elsevier사의 SCOPUS DB에서 KISTI가 분석하여 추출한 것입니다.